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Black
Silver Paste
Product Overview L6656 Silver paste is developed for use on shallow emitter designs to deliver excellent contact to n-Si layer.This paste may be cofired with aluminum paste and rear contact.
Product Introduction
Product phase diagram


Key Benifits

Enables extreme Lightly Doped Emitters (LDE) 

Improved Printability

Wider firing window 

Lower cost

Better contact with silicon wafer

Wide process window

Compatible for PERC process

Cd free


Typical Properties


固含量Solids(%)

90-92

粘度Viscosity (Pa·s)

 

230-350

细度Fineness of grindμm

 

<5

烘干Drying

 

180–250°C, <3 minutes

烧结Firing

 

750–800°C, <5 seconds

细栅高宽比Finger aspect ratio

 

>0.3

焊接所用焊带Ribbon of soldering

 

60Sn/40Pb, 96.5Sn/3.5Agetc.

保质期(月,5-25°C)Storage(months)

 

6



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